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Our employees will attend the 5th International Conference on 2D Materials, paying attention to the latest frontiers

source:beike new material Views:3621time:2020-08-10 QQ Academic Group: 1092348845

Our employees will attend the 5th International Conference on 2D Materials, paying attention to the latest frontiers

The 5th International Conference on 2D Materials and Technology (ICON-2DMAT 2019) is one of the most concentrated, influential, comprehensive and most prestigious international conferences in the world of 2D materials. The 5th International Conference on 2D Materials, hosted by Suzhou Nano, will be held from October 21st to 24th, 2019 at Suzhou International Expo Center & Jinji Lake International Conference Center. The 2nd International Conference on 2D Materials will be held by more than 600 people. It will be attended by representatives from universities and colleges in Europe, America, Japan, South Korea, Southeast Asia, Hong Kong and Taiwan, as well as mainland China.
This conference will focus on: controllable preparation and physics (quantum effects, superconductivity, magnetism, exciton, etc.) including two-dimensional materials (new materials such as graphene, transition metal chalcogenides, black phosphorus, and topological insulators) Relevant topics such as chemistry (energy, environment, catalysis, biology, etc.), devices (electrons, photons, optoelectronics, etc.), theoretical simulations, and two-dimensional materials research under vacuum interconnected environments, conduct international exchanges, conduct industrial analysis and research, and look forward to industrial development. .
In order to better grasp the development direction of the industry and understand the most cutting-edge technology in the development of two-dimensional materials, our company will send employees to participate in this event, to find the direction of the combination of production, education and research, to promote further development of the company and provide better services.

Source: www.icon-2dmat.com


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