Due to the characteristics of high power density, fast charge and discharge speed, and small size, multifunctional flexible micro supercapacitors (MSCs) have broad application prospects in the field of integrated microelectronic systems. In fact, the failure of electronic equipment and systems can be caused by electromagnetic interference (EMI) microwave circuits or radio frequency circuits radiated by nearby objects . Controlling electromagnetic pollution to keep electronic equipment working is extremely important. The introduction of shielding functions in MSCs can save space in micro-scale systems and improve space utilization and packaging density. With unique physical and chemical properties, such as ultra-high intrinsic conductivity, adjustable surface chemistry ( various functional groups such as -O , -OH, and -F) and adjustable layer structure, two-dimensional (2D) Metal carbides / nitrides (MXenes) are expected to become active materials for supercapacitors and MSCs . In addition to its applications in energy storage, MXenes has also shown great application potential in electromagnetic shielding and has been widely reported. Therefore, MXenes is expected to be used in multifunctional integrated systems.

Achievements

Recently, Xi‘an Electronic Science and Technology University of tranquility Dr. in the internationally renowned journal Nano Energypublished entitled "Functional Integrated Electromagnetic Elements Shielding in flexible Micro-Supercapacitors intercalation by cation-typed  Ti 3 C 2 T the X-  MXene" papers. Based on Mn ion intercalation of Ti . 3 C 2 T X  MXene  ( the MIT ), designed a flexible electromagnetic shielding function of MSCs , at 2 mV S ^-1 showed up when 87 cm & lt mF of ^-2 plane capacitance, 11.8 cm & lt mWh ^{- 3}energy density and 44 dB shielding effectiveness. Density functional theory(DFT) The interaction between the intercalated manganese ions and the surface groups (-F , -O , -OH) of Ti 3 C 2 T x was calculated. The interpositional hybridization of Mn 3d and O 2p will lead to the intercalation The content of manganese ions is reduced. This work provides new insights into the basic mechanism of Ti 3 C 2 T x  MXene cation insertion and expands the application of multifunctional devices in the field of integrated microprocessors.

Figure  1  Schematic illustration of the preparation of MIT -based MSCs .

Fig.  2 Morphology of MIT film .  

Figure  3  The structure of MIT .

Figure  4  Electrochemical properties of MIT -based MSCs .

Figure  5 Shielding performance of MIT -based MSCs .

in conclusion

In summary,  in of Ti . 3 C 2 T X introduction of high conductivity manganese ions to prepare a high-performance electromagnetic shielding material. The cationic intercalation mechanism of Ti 3 C 2 T x is discussed in this paper. Manganese ions tend to form a bond with the oxygen-containing end of the interface and combine with Mn 3d and O 2p orbital hybrids. Cationic intercalation can increase the interlayer distance and increase the conductivity of Ti 3 C 2 T x . After the highly conductive manganese ions were introduced into Ti 3 C 2 T x , the prepared MSCs exhibited excellent energy storage capacity and outstanding electromagnetic interference shielding efficiency. This work proposes a new perspective for functional MSCs used in the field of microelectronics under electromagnetic interference, and is of great significance for improving the stability and reliability of integrated circuits.

Original link:

https://www.sciencedirect.com/science/article/pii/S2211285520302986

Source: MXene Academic