| 
				 2-inch Free-standing U-GaN Substrates  | 
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| 
				 
  | 
			
				 Excellent level (S)  | 
			
				 Production level (A)  | 
			
				 Research level (B)  | 
			
				 Dummy level (C)  | 
			
				 
					 
 
 
 
 
 
 
 
 
					Note:  | 
		|||
| 
				 S-1  | 
			
				 S-2  | 
			
				 A-1  | 
			
				 A-2  | 
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| 
				 Dimension  | 
			
				 50.8 ± 1 mm  | 
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| 
				 Thickness  | 
			
				 350 ± 25 μm  | 
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| 
				 Orientation flat  | 
			
				 (1-100) ± 0.5°, 16 ± 1 mm  | 
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| 
				 Secondary orientation flat  | 
			
				 (11-20) ± 3°, 8 ± 1 mm  | 
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| 
				 Resistivity (300K)  | 
			
				 < 0.05 Ω·cm for N-type (Si-doped; GaN-FS-C-N-C50)  | 
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| 
				 TTV  | 
			
				 ≤ 15 μm  | 
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| 
				 BOW  | 
			
				 ≤ 20 μm  | 
			
				 ≤ 40 μm  | 
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| 
				 Ga face surface roughness  | 
			
				 
					< 0.2 nm (polished)  | 
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| 
				 N face surface roughness  | 
			
				 
					0.5 ~1.5 μm  | 
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| 
				 Package  | 
			
				 Packaged in a cleanroom in single wafer container  | 
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| 
				 Useable area  | 
			
				 > 90%  | 
			
				 >80%  | 
			
				 >70%  | 
		|||||
| 
				 <9.9x105 cm-2  | 
			
				 <3x106 cm-2  | 
			
				 <9.9x105 cm-2  | 
			
				 <3x106 cm-2  | 
			
				 <3x106cm-2  | 
		||||
| 
				 Orientation:C plane (0001) off angle toward M-axis  | 
			
				 0.35 ± 0.15°(5 points)  | 
			
				 0.35 ± 0.15°(5 points)  | 
			
				 0.35 ± 0.15°(3 points)  | 
		|||||
| 
				 Macro defect density (hole)  | 
			
				 0 cm2  | 
			
				 < 0.3 cm -2  | 
			
				 < 1 cm -2  | 
		|||||
| 
				 Max size of macro defects  | 
			
				 
  | 
			
				 < 700 μm  | 
			
				 < 2000 μm  | 
			
				 < 4000 μm  | 
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